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Preliminary RF2189 3V, 2.5GHZ LINEAR POWER AMPLIFIER 2 Typical Applications * 2.5GHz ISM Band Applications * PCS Communication Systems * Wireless LAN Systems * Commercial and Consumer Systems * Portable Battery-Powered Equipment * Broadband Spread-Spectrum Systems 2 POWER AMPLIFIERS Product Description 2 1 0.80 TYP 1 The RF2189 is a linear, medium-power, high-efficiency amplifier IC designed specifically for low voltage operation. The device is manufactured on an advanced Gallium Arsenide Heterojunction Bipolar Transistor (HBT) process, and has been designed for use as the final RF amplifier in 2.5GHz spread-spectrum transmitters. The device is provided in a 16-pin leadless chip carrier with a backside ground and is self-contained with the exception of the output matching network and power supply feed line. 3.75 0.75 0.50 0.45 0.28 3.75 + 1.60 4.00 12 1.50 SQ INDEX AREA 3 3.20 4.00 1.00 0.90 0.75 0.65 NOTES: 1 Shaded Pin is Lead 1. 2 Dimension applies to plated terminal and is measured between 0.10 mm and 0.25 mm from terminal tip. 0.05 0.00 Dimensions in mm. The terminal #1 identifier and terminal numbering convention 3 shall conform to JESD 95-1 SPP-012. Details of terminal #1 identifier are optional, but must be located within the zone indicated. The identifier may be either a mold or marked feature. 4 5 Pins 1 and 9 are fused. Package Warpage: 0.05 max. Optimum Technology Matching(R) Applied Si BJT Si Bi-CMOS u Package Style: LCC, 16-Pin, 4x4 GaAs HBT SiGe HBT GaAs MESFET Si CMOS Features * Single 3.3V Power Supply * +25dBm Saturated Output Power * 20dB Small Signal Gain * High Power Added Efficiency VCC2 VCC2 VCC1 14 GND 1 GND GND NC 2 3 4 5 NC 16 15 13 12 11 10 RF OUT Bias Circuits NC * Power Down Mode RF OUT NC * 1800MHz to 2500MHz Frequency Range 6 RF IN 7 NC 8 VPC 9 GND Ordering Information RF2189 RF2189 PCBA 3V, 2.5GHz Linear Power Amplifier Fully Assembled Evaluation Board Functional Block Diagram RF Micro Devices, Inc. 7628 Thorndike Road Greensboro, NC 27409, USA Tel (336) 664 1233 Fax (336) 664 0454 http://www.rfmd.com Rev A4 010424 2-249 RF2189 Absolute Maximum Ratings Parameter Supply Voltage Power Control Voltage (VPC) DC Supply Current Input RF Power Operating Ambient Temperature Storage Temperature Moisture sensitivity Preliminary Refer to "Handling of PSOP and PSSOP Products" on page 16-15 for special handling information. Rating -0.5 to +6.0 -0.5 to 3.3 350 +12 -40 to +85 -40 to +150 JEDEC Level 3 Unit VDC V mA dBm C C Caution! ESD sensitive device. RF Micro Devices believes the furnished information is correct and accurate at the time of this printing. However, RF Micro Devices reserves the right to make changes to its products without notice. RF Micro Devices does not assume responsibility for the use of the described product(s). 2 POWER AMPLIFIERS Parameter Overall Frequency Range Maximum Saturated Output Power Efficiency at Max Output Power Small Signal Gain Reverse Isolation Second Harmonic IM3 IM5 IM7 Isolation Input Impedance Input VSWR Noise Figure Specification Min. Typ. Max. 1800 to 2500 +24 42 20 30 30 -50 -30 -35 -48 -30 50 2:1 7 -23 -30 -35 Unit Condition T=25 C, VCC =3.3V, VPC =3.0V, PIN =0dBm, Freq=2450MHz +23 +26 MHz dBm % dB dB dB dBc dBm dBm dBm dBm dB PIN =+6dBm 19 -20 In "ON" state In "OFF" state Including second harmonic trap, see application circuit POUT =+17dBm in each tone POUT =+17dBm in each tone POUT =+17dBm in each tone In "OFF" state, PIN =0dBm Power Down Power Control "ON" Power Control "OFF" PC Input Impedance 5 3.0 to 5.0 260 150 100 <1 2.7 0 3.0 0.5 V V Voltage supplied to control input; device is "ON" Voltage supplied to control input; device is "OFF" k V mA mA mA A Power Supply Operating Voltage Current Consumption 180 95 50 Current Consumption 320 175 150 10 Power Down "ON", at max output power Power Down "ON", two-tone test +20dBm average output power Idle current Power Down "OFF" 2-250 Rev A4 010424 Preliminary Pin 1 2 3 4 5 6 7 8 Function GND GND GND NC NC RF IN NC PC Description Ground connection. Keep traces physically short and connect immediately to ground plane for best performance. Same as pin 1. Same as pin 1. Not connected. Not connected. RF input. This input is DC coupled, so an external blocking capacitor is required if this pin is connected to a DC path. Not connected. Power control pin. For maximum power this pin should be 3.3V. A higher voltage is not recommended. For less output power and reduced idle current this voltage may be reduced. PC RF2189 Interface Schematic 2 POWER AMPLIFIERS See pin 1. VCC1 500 To RF Stages 9 10 11 GND NC RF OUT Ground connection. Keep traces physically short and connect immediately to ground plane for best performance. Not internally connected. RF output and bias for the output stage. The power supply for the output transistor needs to be supplied to this pin. This can be done through a quarter-wave length microstrip line that is RF grounded at the other end, or through an RF inductor that supports the required DC currents. Same as pin 11. Not connected. Power supply pin for the bias circuits. External low frequency bypass capacitors should be connected if no other low frequency decoupling is nearby. Bias supply pin for the first stage. A small tuning capacitor is required to set the desired frequency response. External low frequency bypass capacitors should be connected as shown in the application schematic if no other low frequency decoupling is nearby. See pin 5. See pin 11. RF OUT 12 13 14 15 RF OUT NC VCC1 VCC2 VCC2 RF IN BIAS 16 Pkg Base VCC2 GND Connected internally to pin 15. Ground connection. The backside of the package should be connected to the ground plane through a short path, i.e., vias under the device may be required. See pin 15. See pin 1 and 6. Rev A4 010424 2-251 RF2189 Evaluation Board Schematic (Download Bill of Materials from www.rfmd.com.) Preliminary C8 10 nF C2 1 nF VCCT VCC 2 POWER AMPLIFIERS L2 1 k Ferrite C30 9 pF C6 10 pF 1 2 3 4 5 6 7 8 16 15 14 13 12 C7 1 F C26 100 pF C4 22 pF L1 3.3 nH Bias Circuits 50 strip 11 10 9 P1 P1-1 1 2 3 C15 22 uF P1-4 P1-5 4 5 CON5 GND VCC VCC VPC P2-2 P2 1 2 CON2 GND VPC C1 2.2 pF C3 15 pF J2 RF OUT C5 15 pF C13 10 nF 50 strip J1 RF IN VPC 2-252 Rev A4 010424 Preliminary Evaluation Board Layout Board Size 2.0" x 2.0" Board Thickness 0.031"; Board Material FR-4 RF2189 2 POWER AMPLIFIERS Rev A4 010424 2-253 RF2189 Preliminary 2 POWER AMPLIFIERS 2-254 Rev A4 010424 |
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